2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Original papers are solicited in the following general areas of interest (but not limited to):

Component-Level Thermal Management

• Single/Multi Chip Module & System in Package

• 3D Packaging & Embedded Cooling

• Hotspot & Impingement Cooling

• Passive Two-Phase Cooling: Heat Pipes, Vapor Chambers, & Thermosyphons

• Pulsating/Oscillating & Non-conventional Heat Pipes

• Thermal Interface Materials and Heat Spreaders

• Thermoelectricity & Peltier Devices

• Novel Air Cooling Techniques & Heat Exchangers

• Pumps, Compressors, Fans & Blowers

• Single-Phase Liquid & Two-Phase Cold Plates

• Boiling/Evaporation/Condensation, Microgap Cooling

System-Level Thermal Management

• Data Center Energy Efficiency

• Thermal Storage

• Immersion Cooling, Refrigeration

• Mobile, Internet of Things, MEMS

• Telecommunication Systems

• Automotive

• Space and Aerospace

• Power Electronics

• LEDs

• Photovoltaics

• RF Electronics

• Batteries

Mechanics & Reliability

• Thermo-Mechanical Modeling and Simulation of Devices,

• Components, Boards, and Systems

• Mechanics and Reliability of Solder Joints & Interconnects

• Materials Characterization, Processing, Constitutive Models

• Failure Mechanics, Fatigue, Damage Modeling

• Experimental Techniques for Packaging Deformations, Strains, and Stresses

• Shock, Drop, and Vibrational Analysis of Packages, Sub- Systems, and Systems

• TSV / 3D Reliability and Packaging Challenges

• Mechanics Issues in Assembly and Manufacturing

• Applied Reliability for Failure Detection and Characterization

• Process-Structure-Property Correlations / Multi-Scale

• Analyses for Degradation and Failure

• Accelerated Stress Testing and Modelling

• Lifetime Prognostics and Condition Monitoring

Emerging Technologies and Fundamentals

• Numerical Methods from Nano-to-Macro Scale

• Experimental Methods from Nano-to-Macro Scale

• Nanotechnology Including 1-D and 2-D Materials

• Thermal Interface Materials and Phase Change Materials

• Embedded Cooling

• Transistor Technology

• Novel Materials and Fabrication Techniques

• Measurement and Instrumentation Techniques

• Prognostic Health Management and Reliability Analysis

• Flexible Electronics