Timetable
Timezone：Asia/Beijing
Important Date
-
Conference Date
May 29
2018
toJun 01
2018
-
Sep 04 2017
Abstract Submission Deadline
-
Dec 18 2017
Draft paper submission deadline
-
Feb 05 2018
Draft Paper Acceptance Notification
-
Mar 05 2018
Final Paper Deadline
-
Jun 01 2018
Registration deadline
Sponsored By
IEEE
Contact Information
- Jeffrey Suhling
- js******@auburn.edu
- +1-*********
- li******@listserv.ieee.org
- +1-*********
Previous Conferences
-
2031-05-27 United States Dallas
2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2028-05-30 United States Dallas
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2021-06-01 United States San Diego
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2020-05-26 United States Orlando
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2019-05-29 United States
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2017-05-30 United States Orlando
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2016-05-31 United States Las Vegas, USA
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2014-05-27 United States
2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
