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Introduction

The aim of the SSL International forum is to promote international communication and cooperation on SSL technology and application and to lead the development direction of the emerging industry of SSL. It comprehensively covers LED technologies, related equipment, materials and processes, innovative development of lighting product and applications, provides cooperation platform for the entire industry chain of the globe, devotes to exploring target markets which the industry concerns about, and perpetually creating business values with professional spirits. While IFWS is aiming at promoting collaborative innovation of industries including wide band gap semiconductor materials, equipments, devices and related applications. This forum will focus on the roadmap, application needs, integrated innovation of wide bandgap semiconductor technology and other topics, divided into several sessions for in-depth discussions.

Call for paper

Important date

2017-07-31
Draft paper submission deadline

Scope:

  • New Progress of LED Chip Manufacturing Technologies
  • Chip Shrinkage to micro-size and its technical challenges
  • High Efficient UV, Blue, Green and Red Chip Technology
  • Mounted Chips, Flip Chip and Vertical Chip Technology
  • Latest Development of LED Packaging Materials (Substrate, Solid Crystal Materials, Silica Gel, Fluorescent Powder, etc.)
  • Fluorescent Powder, Quantum Dot Technology and Coating Technology
  • Lens Design and Optic Module
  • Chip level and Wafer Level Packaging Technology
  • Multi-chip Packaging, Design and Optimization of COB
  • New Development of Light Source with High Quality and Full Spectrum
  • Advanced Packaging Technology and Manufacturing Technology with High Sigma and Low Color Tolerance
  • The New Generation of LED Light Source and Light Engine
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Important Date

  • Conference Date

    Nov 01

    2017

    to

    Nov 03

    2017

  • Jul 31 2017

    Draft paper submission deadline

  • Nov 03 2017

    Registration deadline

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