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Introduction

China International Forum on Solid State Lighting (SSLCHINA), sponsored by China Solid State Lighting Alliance, is an annual grand event of SSL series of forum in China. SSLCHINA is a global forum, which has the largest scale and participation and the highest public praise in the SSL field. The aim of the SSL International forum is to promote international communication and cooperation on SSL technology and application and to lead the development direction of the emerging industry of SSL. It comprehensively covers LED technologies, related equipment, materials and processes, innovative development of lighting product and applications, provides cooperation platform for the entire industry chain of the globe, devotes to exploring target markets which the industry concerns about, and perpetually creating business values with professional spirits.

This year, 13th China International Forum on Solid State Lighting (SSLCHINA 2016) will be held in Beijing in a new form and theme, and 2016 China (Beijing) International Technology Transfer Convention and International Forum on Wide Bandgap Semiconductors sponsored by the Beijing municipal government and the Ministry of Science and Technology will be held in the same location concurrently. It offers us good chance to discuss the future industrial development plan.

Call for paper

Important date

2016-07-15
Abstract submission deadline
2016-09-25
Draft paper submission deadline
2016-10-15
Draft paper acceptance notification
2016-10-28
Final paper submission deadline

Submission Topics

FOR SSLCHINA
1. Materials and Equipment Technologies

  • Substrate Material Technology

  • Epitaxial Material Technology

  • Technology of MOCVD or Other Related Substrate Epitaxy Equipment

  • Material Testing Technology and Equipment

  • New Substrate and Epitaxial Material Technology

  • Innovative Materials for LED Devices

  • Process Control and Cost Management

2. Technologies for Chip, Device, Packaging and Modules

  • New Progress of LED Chip Manufacturing Technologies

  • High efficiency blue, green and red chip technology

  • Latest Development of LED Packaging Materials (Substrate, Solid Crystal Materials, Silica Gel, Fluorescent Powder, etc.)

  • Fluorescent Powder, Quantum Dot Technology and Coating Technology

  • Lens Design and Optic Module

  • Chip level and Wafer Level Packaging Technology

  • Multi-chip Packaging, Design and Optimization of COB

  • New Development of Light Source with High Quality and Full Spectrum

  • Advanced Packaging Technology and Manufacturing Technology with High Sigma and Low Color Tolerance

  • The New Generation of LED Light Source and Light Engine

3. Technologies for Reliability and Thermal Management

  • Novel Materials for Heat Dissipation

  • Thermal Management Technologies

  • Research and Design for Reliability of LED Lighting System

  • Fault Diagnosis and Prediction

  • Failure Detection and Failure Analysis

  • Accelerated Life Testing and Prediction Methods

  • Failure Mode and Simulation

  • Control and Reliability Screening in Manufacturing Process

4. Driver, Intelligence and Control Technologies

  • Power Management and High Efficiency Driving Solutions

  • New Drive Circuit and Integrated IC

  • LED Dimming and Modulating Color Temperature Techniques

  • Solution for Controlling Lighting Product

  • Wireless Communications (ZigBee, Bluetooth, Wifi, Thread, Lifi, etc.)

  • Integration of Intelligent Lighting and Intelligent Home System

  • New Interconnect Technologies

  • Intelligent LED Lighting System and Sensor Technology

  • Modularization and Standardization of Drive

  • Network Intelligent Lighting and POE Lighting Technology

5. Bio-Agriculture Lighting

  • Advances in Biological (Animal and Plant) Responses to Light Qualities

  • Bio-Agricultural Light Recipes Technology

  • Manufacturing Technology and New Technology of Bio-Agricultural LED Lamps

  • Advances in LED Modern Agriculture (Plant Factory, Breeding Factory, Supplementary Lighting In Greenhouses, Livestock Breeding, Propagation of Edible Fungi and Microalgae Plant Protection by Trapping Insets)

  • Energy Saving Design in LED for Bio-Agriculture

  • Intelligent Control Technology of LED for Agriculture

  • Design and Optimization of Low Cost LED for Agriculture

6. Light Quality and Lighting for Health and Medicine

  • Study on LED, Spectrum, Brightness and Visual Function

  • A Study of the Mechanism of Blue Light Damage to Vision

  • Effects of Spectrum and Brightness on Visual Development

  • Study the Effect of LED and Spectrum on Development and Progression of Ametropia such as Shortsightedness

  • Quality Evaluation and Application of LED Light Environment in Indoor and Outdoor

  • Study on the Mechanism of LED Light Therapy

  • LED Medical Health Lighting and its Application


FOR IFWS 
1. SiC Power Electronic Devices Technology

  • SiC Substrate Growth Technology

  • SiC Homo-epitaxial Growth Technology

  • SiC Material Defects and Characterization

  • SiC Power Electronic Devices Technology

  • Reliability Issues in SiC Power Electronic Devices 

  • Packaging for SiC Power Electronic Devices

  • SiC Power Electronics Application

  • Market Research for SiC Power Electronic Technology

 2. Power Electronic Devices based on GaN and other wide band-gap semiconductors

  • GaN Based Heterostructure Epitaxial Growth and Defects, and Stress Control on Large Size Substrate

  • GaN based Power Electronic Devices Technology

  • GaN substrate Meterials and Homogeneous Epitaxial with Thick Film

  • Reliability of GaN Power Electronic Devices

  • GaN Device Packaging Technology

  • GaN Power Electronics Application

  • Market Research of GaN Power Electronic Technology

  • Other Electronic Materials and Devices of Wide Bandgap Semiconductor


3. RF Technology based on Wide Bandgap Semiconductors

  • High Efficiency GaN Microwave Wave Device Technology

  • Reliability of GaN Microwave Device

  • GaN Epitaxial Technology for High Efficiency Microwave Device

  • GaN Monolithic Microwave IC Design

  • Big Signal Equivalent Circuit Modeling and Physical Modeling of GaN Microwave Devices

  • Application of GaN devices and circuits in mobile communication

 
4. Wide Bandgap Semiconductors and Solid-State Ultraviolet Devices

  • Wide Bandgap Semiconductor Ultraviolet Luminescent Material and Novel Substrate

  • Wide Bandgap Semiconductor Ultraviolet Detecting Material

  • Design and Growth of High Efficient Quantum Structure

  • High Efficiency Solid State Ultraviolet Light Emitting Device

  • High Sensitivity Ultraviolet Detection and Imaging Device

  • Light Extraction, Thermal Management and Reliability of UV Packaging and Modules

  • New Progress of Ultraviolet Light Source and Detection Application

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Important Date
  • Conference Date

    Nov 15

    2016

    to

    Nov 17

    2016

  • Jul 15 2016

    Abstract Submission Deadline

  • Sep 25 2016

    Draft paper submission deadline

  • Oct 15 2016

    Draft Paper Acceptance Notification

  • Oct 28 2016

    Final Paper Deadline

  • Nov 17 2016

    Registration deadline

Sponsored By
China Solid-State Lighting Alliance (CSA)