Presentation List

Power Semiconductor IGBT Packaging Technology and Reliability

Yameng Sun student Wuhan University

P /P2 2021-08-27 12:10 ~ 12:15

PUBLIC Poster Presentation

Research on A Novel Parallel Resonant DC Link Soft-switching Inverter Based on SiC MOSFET

Si Li doctoral candidate Harbin Institute of Technology

P /P5 2021-08-27 12:30 ~ 12:35

PUBLIC Poster Presentation

Comparison of the Influence of Reverse Conduction on EMI of WBG And Si Devices

Ru Zhang School of Electrical Engineering； Xi’an Jiaotong University

P /P4 2021-08-27 12:00 ~ 12:05

PUBLIC Poster Presentation

A Novel ACDC Single-Phase Bridgeless SEPIC PFC Converter With Reduced Conduction Losses and Simple Structure

Xiang Lin Shanghai University

P /P5 2021-08-27 12:55 ~ 13:00

PUBLIC Poster Presentation

Ultra-thin Coupled Inductor for a GaN-Based CRM Buck Converter

Ming Hua Nanjing Research Institute of Electronics Technology

P /P2 2021-08-27 12:40 ~ 12:45

PUBLIC Poster Presentation

Degradation mechanism of AlGaN/GaN HEMT based on high temperature reverse bias stress

Meng Lu Xiangtan University

P /P4 2021-08-27 12:40 ~ 12:45

PUBLIC Poster Presentation

Mode Switchover Strategy for Multi-port Energy Router Based on State Flow Diagram

Zhiguo Wei China University of Geosciences (Wuhan)

P /P5 2021-08-27 13:20 ~ 13:25

PUBLIC Poster Presentation

A Dynamic Current Sharing Method in Multi-chip SiC Power Module Using Stacked DBC Bridges and Decoupling Capacitors Based on the Original Simple Module Layout

Jianwei Lv Huazhong University of Science and Technology

P /P4 2021-08-27 12:45 ~ 12:50

PUBLIC Poster Presentation

Automated SiC MOSFET Power Module Switching Characterization Test Platform

Shuhao Yang Fudan University

P /P3 2021-08-27 12:45 ~ 12:50

PUBLIC Poster Presentation

LLC Resonant Converter Based on Trench Gate SiC MOSFET

Jinkun Chu Anhui University of Technology

P /P5 2021-08-27 13:10 ~ 13:15

PUBLIC Poster Presentation

IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WIPDA-ASIA 2021)

Power Semiconductor IGBT Packaging Technology and Reliability

Research on A Novel Parallel Resonant DC Link Soft-switching Inverter Based on SiC MOSFET

Comparison of the Influence of Reverse Conduction on EMI of WBG And Si Devices

A Novel ACDC Single-Phase Bridgeless SEPIC PFC Converter With Reduced Conduction Losses and Simple Structure

Ultra-thin Coupled Inductor for a GaN-Based CRM Buck Converter

Degradation mechanism of AlGaN/GaN HEMT based on high temperature reverse bias stress

Mode Switchover Strategy for Multi-port Energy Router Based on State Flow Diagram

A Dynamic Current Sharing Method in Multi-chip SiC Power Module Using Stacked DBC Bridges and Decoupling Capacitors Based on the Original Simple Module Layout

Automated SiC MOSFET Power Module Switching Characterization Test Platform

LLC Resonant Converter Based on Trench Gate SiC MOSFET

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