Program
Timezone：Asia/Beijing
Program Overview
Important Date
-
Conference Date
Oct 23
2014
toOct 26
2014
-
Sep 14 2014
Abstract Submission Deadline
-
Oct 26 2014
Registration deadline
Sponsored By
University of Bucharest
RO
RO
Contact Information
- si******@siitme.ro
- -**********
- 004*********
Previous Conferences
-
2022-10-26 Romania Bucharest
2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging -
2021-10-27
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging -
2018-10-25 Romania
2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging -
2017-10-26 Romania
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging -
2016-10-20 Romania Oradea, Romania
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging -
2013-10-24 Romania
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)
