Abstract List
My SubmissionsImportant Date
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Conference Date
Jun 01
2021
toJun 04
2021
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Oct 26 2020
Draft paper submission deadline
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Mar 08 2021
Final Paper Deadline
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Jun 04 2021
Registration deadline
Sponsored By
IEEE Electronics Packaging Society
Contact Information
Previous Conferences
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2031-05-27 United States Dallas
2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2028-05-30 United States Dallas
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2020-05-26 United States Orlando
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2019-05-29 United States
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2018-05-29 United States
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2017-05-30 United States Orlando
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2016-05-31 United States Las Vegas, USA
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -
2014-05-27 United States
2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
