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Introduction

The 16th International Workshop on Junction Technology (IWJT2016) will be held on May 9 - 10, 2016 in Shanghai, China. The IWJT, started in 2000 and was held annually in Japan or China, is an open forum focused on the needs and interest of the community of a junction formation technology in semiconductors. At the past IWJTs, a number of eminent and experienced scientists and engineers from Asia, America, and Europe presented their latest results on junction technology. The workshop will provide a good opportunity for researchers and engineers to present their new research results, and exchange ideas with leading scientists in this field.

Call for paper

Submission Topics

Workshop Scope

  • (Papers are solicited in, but not limited to the following)
  • Doping Technology --- Ion implantation, plasma doping, gas and solid doping
  • Annealing Technology --- Rapid thermal process, laser annealing, flash annealing, SPE, lattice damage and defects
  • Junction Technology for Novel CMOS Device Structures --- Junction for SOI, strained Si, SiGe, Ge, Schottky barrier S/D MOSFET, and FinFET(Tri-gate FET)
  • Silicide and Contact Technology for CMOS --- Silicide materials and salicide technology, elevated S/D, low barrier contact, surface pre-treatment
  • Junction and Contact Technologies for Compound Semiconductors and Quantum Devices --- Schottky and ohmic contacts to wide bandgap compound semiconductors, junction and contact technologies for carbon nanotube, graphene, 2D material and other 2D or nano-, quantum devices, hetero-junction devices
  • Contact and Junction Technologies for Energy Harvesting Devices---solar cells
  • Characterization for Shallow Junction --- Physical and electrical characterization of ultra-shallow junction
  • Modeling and Simulation --- Modeling and simulation of ultra-shallow junction formation of CMOS
  • Equipment, Materials and Substrates for Junction Technology
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Important Date
  • Conference Date

    May 09

    2016

    to

    May 10

    2016

  • May 10 2016

    Registration deadline

Sponsored By
复旦大学
Organized By
Fudan University
Contact Information