Design Methodologies, Verification Within-die circuits for process characterization/monitoring, design enablement – characterization and validation of digital and analog libraries and devices and circuit modeling. DC, AC and RF measurements: setup, test and analysis, Reliability test - including thermal stability, failure analysis, prediction, etc. Statistical analysis, variability, throughput increase, smart test strategies. Use of machine learning and AI in analysis of data sets - parameter extraction etc. Wafer probing, within-die measurements, in-line metrology. Throughput, testing strategies, yield enhancement and process control tests. Applications: Emerging memory technologies (single cell, arrays, and application in neural networks), emerging transistor technologies for digital/analog/power applications, photonic devices - silicon integration, new displays (OLED, μ-displays), flexible electronics and sensors. M(N)EMS, actuators, sensors, PV cells and other emerging devices.
Sponsor Type:1; 9
General Chair:
Satoshi Habu
Keysights Technologies, Japan
Technical Program Chair:
Yuzo Fukuzaki
TechInsights
Tutorial Chair:
Tatsuya Ohguro
Toshiba Electronic Devices & Storage
Corporation
Original papers are solicited presenting new developments in topics relevant to ICMTS, including but not limited to, test structures, measurements, and results, in the following areas:
Design
Methodologies, Verification
Within-die circuits for process characterization/monitoring
Design enablement – Characterization and validation of digital and analog libraries
Devices and Circuit Modeling
Measurement techniques
DC, AC and RF measurements: setup, test and analysis
Reliability test - including thermal stability, failure analysis, prediction, etc.
Statistical analysis, variability, throughput increase, smart test strategies
Use of machine learning and AI in analysis of data sets - parameter extraction etc.
Wafer probing, within-die measurements, in-line metrology
Throughput, testing strategies, yield enhancement and process control tests
Applications
Emerging memory technologies (single cell, arrays, and application in neural networks)
Emerging transistor technologies for digital/analog/power applications
Photonic devices - silicon integration, new displays (OLED, ?-displays)
Flexible electronics and sensors (organic and inorganic materials)
M(N)EMS, actuators, sensors, PV cells and other emerging devices
Mar 27
2023
Mar 30
2023
Abstract Submission Deadline
Registration deadline
2025-03-24 United States San Antonio
2025 IEEE 37th International Conference on Microelectronic Test Structures (ICMTS)2021-04-12 United States Cleveland
2021 IEEE 34th International Conference on Microelectronic Test Structures2018-03-19 United States
2018 IEEE International Conference on Microelectronic Test Structures2017-03-28 France Grenoble,France
30th International Conference on Microelectronic Test Structures2016-03-28 Japan Yokohama
2016 International Conference on Microelectronic Test Structures2014-03-24 Italy
2014 International Conference on Microelectronic Test Structures2013-03-25 Japan
2013 IEEE International Conference on Microelectronic Test Structures
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