Introduction

Design Methodologies, Verification Within-die circuits for process characterization/monitoring, design enablement – characterization and validation of digital and analog libraries and devices and circuit modeling. DC, AC and RF measurements: setup, test and analysis, Reliability test - including thermal stability, failure analysis, prediction, etc. Statistical analysis, variability, throughput increase, smart test strategies. Use of machine learning and AI in analysis of data sets - parameter extraction etc. Wafer probing, within-die measurements, in-line metrology. Throughput, testing strategies, yield enhancement and process control tests. Applications: Emerging memory technologies (single cell, arrays, and application in neural networks), emerging transistor technologies for digital/analog/power applications, photonic devices - silicon integration, new displays (OLED, μ-displays), flexible electronics and sensors. M(N)EMS, actuators, sensors, PV cells and other emerging devices.

Sponsor Type:1; 9

Committee

General Chair:

Satoshi Habu
Keysights Technologies, Japan

Technical Program Chair:

Yuzo Fukuzaki
TechInsights

Tutorial Chair:

Tatsuya Ohguro
Toshiba Electronic Devices & Storage
Corporation

Call for paper

Important date

2022-10-15
Abstract submission deadline

Submission Topics

Original papers are solicited presenting new developments in topics relevant to ICMTS, including but not limited to, test structures, measurements, and results, in the following areas:

Design

Methodologies, Verification
Within-die circuits for process characterization/monitoring
Design enablement – Characterization and validation of digital and analog libraries
Devices and Circuit Modeling

Measurement techniques

DC, AC and RF measurements: setup, test and analysis
Reliability test - including thermal stability, failure analysis, prediction, etc.
Statistical analysis, variability, throughput increase, smart test strategies
Use of machine learning and AI in analysis of data sets - parameter extraction etc.
Wafer probing, within-die measurements, in-line metrology
Throughput, testing strategies, yield enhancement and process control tests

Applications

Emerging memory technologies (single cell, arrays, and application in neural networks)
Emerging transistor technologies for digital/analog/power applications
Photonic devices - silicon integration, new displays (OLED, ?-displays)
Flexible electronics and sensors (organic and inorganic materials)
M(N)EMS, actuators, sensors, PV cells and other emerging devices

Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Mar 27

    2023

    to

    Mar 30

    2023

  • Oct 15 2022

    Abstract Submission Deadline

  • Mar 30 2023

    Registration deadline

Sponsored By
Electrical and Electronic Information Academic Progress Foundation
IEEE Electron Devices Society