Introduction
The International Conference on Microelectronic Test Structures (ICMTS) is the premier conference devoted to the development, measurement and analysis of test structures providing a forum for designers and users of test structures to discuss recent developments and future directions The meeting is a IEEE conference, sponsored by the IEEE Electron Devices Society. The 26th International Conference on Microelectronic Test Structures will be held at Osaka University Nakanoshima Center, Osaka, Japan, bringing together designers and users of test structures to discuss recent developments and future directions. The conference will be held on March 26-28, 2013, preceded by a one-day Tutorial Short Course on Microelectronic Test Structures on March 25. There will be an equipment exhibition relating to test structure measurements. Original papers are solicited presenting new developments in test structures, as well as their implementation and/or application, related to silicon, semiconductors, nanotechnology and MEMS. A Best Paper award will be presented by the Technical Program Committee. The conference will be held in cooperation with the Institute of Electronics, Information and Communication Engineers and, the Japan Society of Applied Physics, and will be sponsored by the IEEE Electron Devices Society, and the Association for Promotion of Electrical, Electronic and Information Engineering.
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Submission Topics

Suggested topics include (but are not limited to): Material and Process Characterization: Evaluation of wafer start materials (Si, SiGe, strained silicon, SOI, III-V, II-VI, etc.), dielectrics (high-k gate, low-k interconnect), homoepitaxial and heteroepi
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Important Date
  • Conference Date

    Mar 25

    2013

    to

    Mar 28

    2013

  • Mar 28 2013

    Registration deadline

Sponsored By
IEEE Electron Devices Society
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