We are pleased to announce the upcoming 6th International Conference “2025 Devices for Integrated Circuit (DevIC)”, to be held at Kalyani Government Engineering College from 5-6 April, 2025, organized by IEEE EDS Kolkata Chapter and IEEE KGEC Student Branch Chapter in association with the Department of ECE, KGEC. There will be keynote lectures/talks, tutorials, and oral presentations  by eminent researchers. We solicit original research and technical papers not published elsewhere.

Message from the General Chair:
DevIC 2025 aims to bring together leading scientists, researchers, engineers, and scholar students to exchange and share their experiences, new ideas, and research results about all aspects of device technology & modeling to discuss the practical challenges encountered and the solutions adopted. The conference also will provide an opportunity to local, regional and international industries-service providers to present their technologies, products and services. Moreover, we want to continue our conference in the subsequent years also, to build a community against the conference.

The aim and objective of DevIC 2025 is to provide a forum for the presentation and discussion of recent advances in solid-state devices, circuits and systems. The increasing level of integration for system-on-chip design made available by advances in silicon technology is more than ever before calling for a deeper interaction among technologists, device experts, IC designers, and system designers.

More details on the invited talks and special sessions will be announced as they become available. For additional inquiries please contact the conference chairs.

We hope to see you at the Kalyani Govt. Engg. Colleg on 5-6 April, 2025!

Best regards,

Dr. Angsuman Sarkar, General Chair, DevIC 2025

General purpose of the conferences:

The general purpose of DevIc 2025 is to recognize the importance of interaction between device, circuits, systems and electronic materials research and provides for fruitful exchange of information between attendees of the conference.

Electronic Submission link: TBA

Extended Version:

Extended versions of selected quality papers from the conference will be invited for review and potential publication in:


Important Dates:

Final Paper submission deadline: 1 February, 2025

Author notification after 1st round of review: 7 February, 2025

Date of re-submission of revised manuscript: 20 February, 2025

Last date of the Notification of final acceptance: 15 March, 2025

Last date for payment of Registration Fee: 20 March, 2025

Camera-ready paper deadline: 30 March 2025

Conference Date: 5-6 April, 2025

Special Sessions:

Key attractions include:

Plenary and invited presentations given by leading scientists/ industry leaders in the field of Electronics Devices.

Highly selective program of contributed papers on electronic device modelling/experiments/simulations and applications in circuits/systems.

Informative, timely short invited talks in rapidly developing fields (recently: graphene, 2D materials, memory, post-CMOS).

Encouragement to frank and open technical discussion of recent advancements.

Nominal registration fee (for details visit registration page)

Special sessions:  Encourages potential researchers to submit your own paper(s) or/and to propose, organize, chair and manage a special session during the conference. Each session will contain 4-6 papers in a related field as per the theme of the conference.
Session organizers will receive:

Certificate of Appreciation

Session chair certificate

Registration fee discounts

A Special Publishing Theme will be included within Conference Proceedings and will be submitted to IEEE.


Papers are solicited across the general field of electronic devices and their applications in circuits, systems and high frequency wireless communication. Topics of interest include, but are not limited to:

Emerging Non-CMOS Devices & Technologies:

Ultra scaled CMOS and memory technologies:


Advanced nanoscale devices for Internet of Nano Things (IoNT):

Devices with Low temperature processing:

Organic and 2D electronics :

Chalcogenide devices:

Carbon electronics:

Device Modelling & Simulation:

Device Characterization, Reliability & Yield:

Flexible and Wearable devices:


Low-power devices for circuit applications:

Devices with New material systems:

Devices for Low power applications:

Low dimensional devices:

Design and Simulation of Circuits with nanoscale devices:

Emerging nano-sensors:

3D packaging and SoC Designs:

Monolithic 3D integration:


Embedded Non-Volatile-Memories like PC RAM, CBRAM or OxRAM:

MEMS, Sensors & Display Technologies:

Advanced & Emerging Memory Technologiies:

CMOS Processes, Devices and Integration:

Nano Machines:

Nano sensors network:

Hardware-based deep learning Artificial Intelligence

Infusion of machine learning capabilities in CPU/GPU

Computational intelligence and electronic systems

AI accelerators design, Multicore Implementation, ASIC

Computational intelligence design and applications

Embedded architectures, VLSI based system design with Artificial Intelligence and Machine Learning

Approximate computing, In-memory computing, Machine intelligence and quantum computing

Heterogenous Integration

Call for paper

Important date

1970-01-01 00:00:00
Abstract submission deadline
1970-01-01 00:00:00
Abstract notification of acceptance
2024-10-25 00:00:00
Draft paper submission deadline
1970-01-01 00:00:00
Draft paper acceptance notification
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Important Date
  • Conference Date

    Mar 24



    Mar 27


  • Oct 25 2024

    Draft paper submission deadline

  • Mar 27 2025

    Registration deadline

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