Introduction

Characterization, modeling and design for signal and power integrity of electronic systems. Modeling, simulation and measurement of electrical interconnect performance at chip, board and package levels. Innovative CAD concepts and algorithms. Applications to computing devices, mobile devices, automotive/aerospace.

Call for paper

Important date

2018-01-19
Draft paper submission deadline
2018-03-02
Draft paper acceptance notification
2018-03-17
Final paper submission deadline
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Important Date

  • Conference Date

    May 22

    2018

    to

    May 25

    2018

  • Jan 19 2018

    Draft paper submission deadline

  • Mar 02 2018

    Draft Paper Acceptance Notification

  • Mar 17 2018

    Final Paper Deadline

  • May 25 2018

    Registration deadline

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