Introduction

Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation. In view of last year's success, the Committee is looking forward to the 23rd Edition which will convene in the French Alpes, in the charming town of Chambery, on the shores of the Bourget lake. The SPI2019 technical program will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN code and will appear in IEEE Xplore. On this web site you can find all information regarding the 23rd IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in France!

Call for paper

Important date

2019-03-01
Draft paper submission deadline

TOPICS OF INTEREST

  • Modeling and simulation for SI/PI
  • Coupled Signal and Power Integrity analysis
  • Noise reduction and equalization techniques
  • High-speed link design and modeling
  • Power distribution networks
  • RF/microwave/mm-wave packaging solutions
  • Antennas-in-package and antennas-on-chip
  • 3D IC and packages (TSV/SiP/SoC)
  • Nano-interconnects and nano-structures
  • Electromagnetic theory and modeling
  • Transmission line theory and modeling
  • Macromodeling and reduced order models
  • Electromagnetic compatibility
  • Design methodology/flow
  • Measurements
  • Jitter and noise modeling
  • Stochastic/sensitivity analysis
  • Electro-thermal modeling
  • Chip-package co-design
  • Novel CAD concepts
  • Optical interconnects
Submit Comment
Verify Code Change Another
All Comments
Important Date
  • Conference Date

    Jun 18

    2019

    to

    Jun 21

    2019

  • Mar 01 2019

    Draft paper submission deadline

  • Jun 21 2019

    Registration deadline