Introduction

Over the past nineteen years, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.

 

In view of last years success, the Committee is looking forward to the 20th Edition which will convene in Turin, Italy. The SPI 2016 technical program will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN code and will appear in IEEE Xplore.

 

On this web site you can find all information regarding the 20th IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in Turin!

Call for paper

Submission Topics

TOPICS OF INTEREST

  • modeling and simulation for SI/PI
  • coupled Signal and Power Integrity analysis
  • noise reduction and equalization techniques
  • high-speed link design and modeling
  • power distribution networks
  • RF/microwave/mixed signal systems
  • 3D IC and packages (TSV/SiP/SoC)
  • nano-interconnects and nano-structures
  • electromagnetic theory and modeling
  • transmission line theory and modeling
  • macromodeling and reduced order models
  • electromagnetic compatibility
  • design methodology/flow
  • measurements
  • jitter and noise modeling
  • stochastic/sensitivity analysis
  • electro-thermal modeling
  • chip-package co-design
  • novel CAD concepts
  • optical interconnects
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Important Date

  • Conference Date

    May 08

    2016

    to

    May 11

    2016

  • May 11 2016

    Registration deadline

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