Introduction

Over the past eighteen years, this workshop has evolved into a forum of exchange on the latest research and developments on innovative schemes for signal and power integrity, and in the field of interconnect modeling, simulation and measurement at chip board and package levels. The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation. In view of last year’s success, the Committee is looking forward to the 19th Edition which will convene in Berlin, Germany. The symposium will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN and will appear in IEEE Xplore. On this website you can find all information regarding the 19th IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in Berlin!

Call for paper

Submission Topics

TOPICS Emerging and advanced issues New design techniques and innovative architectures Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization with emphasis on: Innovative schemes for SI and PI Noise reduction techniques High-speed link design and modeling Power distribution networks Electronic packages and microsystems 3D technologies for IC and packages RF, microwave, mixed signal packaging Nano-interconnects and nano-structures Electromagnetic theory and modeling Transmission line theory and modeling Macro-modeling, reduced order models Simulation tools for SI and PI Electromagnetic Compatibility Design methodology/flow Measurements Jitter and noise modeling Chip-package co-design Novel CAD concepts
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Important Date
  • Conference Date

    May 10

    2015

    to

    May 13

    2015

  • May 13 2015

    Registration deadline

Sponsored By
IEEE Components
Packaging and Manufacturing Technology Society
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