Introduction
Over the past two decades, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.
In view of previous years success, the Committees are hardworking and keen on the 27th Edition which will be held in Aveiro, Portugal. The SPI 2023 technical program will include both oral and poster sessions, and several prominent experts will be giving keynotes on areas of emerging interest.
Feel free to look into our website for further information about SPI 2023, as well as broadcast the workshop in your institution and to your fellow colleagues and students. It is a pleasure to invite you all to the 27th IEEE Workshop on Signal and Power Integrity and we look forward to your contribution and participation!
Sponsor Type:1; 1; 1; 9
Committee
Workshop Chairs
Joana Catarina Mendes
Instituto de Telecomunicações, Aveiro (POR)
Stefano Grivet-Talocia
Politecnico di Torino, Torino (ITA)
Program Chairs
Antonio Maffucci
University of Cassino and Southern Lazio, Cassino (ITA)
Stanislav Maslovski
Instituto de Telecomunicações, Aveiro (POR)
Standing Committee
Uwe Arz
Physikalisch-Technische Bundesanstalt, Braunschweig (GER)
Flavio G. Canavero
Politecnico di Torino, Torino (ITA)
Hartmut Grabinski
Leibniz University Hannover, Hannover (GER)
Stefano Grivet-Talocia
Politecnico di Torino, Torino (ITA)
Antonio Maffucci
University of Cassino and Southern Lazio, Cassino (ITA)
Michel S. Nakhla
Carleton University, Ottawa (CAN)
José E. Schutt-Ainé
University of Illinois, Urbana-Champaign (USA)
Madhavan Swaminathan
Georgia Institute of Technology, Atlanta (USA)
Call for paper
Important date
Submission Topics
• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design
All Comments
Important Date
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Conference Date
May 07
2023
toMay 10
2023
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Jan 31 2023
Draft paper submission deadline
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May 10 2023
Registration deadline
Sponsored By
IEEE Electronics Packaging Society
IEEE Microwave Theory and Techniques Society
Instituto de Telecomnicações
Contact Information
Previous Conferences
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2022-05-22 Germany Siegen
2022 IEEE 26th Workshop on Signal and Power Integrity -
2021-05-10
2021 IEEE 25th Workshop on Signal and Power Integrity (SPI) -
2019-06-18 France Chambéry
2019 IEEE 23rd Workshop on Signal and Power Integrity -
2018-05-22 France Brest
2018 IEEE 22nd Workshop on Signal and Power Integrity -
2017-05-07 Italy Baveno,Italy
2017 IEEE 21st Workshop on Signal and Power Integrity -
2016-05-08 Italy Turin, Italy
2016 IEEE 20th Workshop on Signal and Power Integrity -
2015-05-10 Germany
2015 IEEE 19th Workshop on Signal and Power Integrity -
2014-05-11 Belgium
2014 IEEE 18th Workshop on Signal and Power Integrity -
2013-05-12 France
2013 17th IEEE Workshop on Signal and Power Integrity
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