Introduction

Over the past twenty years, the IEEE Workshop on Signal and Power Integrity (SPI) has evolved into a forum of exchange on the latest research and developments on design, characterization, modeling, simulation and testing for Signal and Power Integrity at chip, package, board and system level. The workshop brings together developers and researchers from industry and academia in order to encourage cooperation.

In view of last years success, the Committee is looking forward to the 21st Edition which will convene in the charming Italian Northern Lakes Region, in the picturesque small town of Baveno, on the coast of Lake Maggiore. The SPI 2017 technical program will include both oral and poster sessions. A number of prominent experts will be giving tutorials on areas of emerging interest. The Conference Proceedings will be published with an ISBN code and will appear in IEEE Xplore.

On this web site you can find all information regarding the 21st IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in Italy!

Call for paper

Important date

2017-03-10
Draft paper acceptance notification

Submission Topics

  • modeling and simulation for SI/PI

  • coupled Signal and Power Integrity analysis

  • noise reduction and equalization techniques

  • high-speed link design and modeling

  • power distribution networks

  • RF/microwave/mixed signal systems

  • 3D IC and packages (TSV/SiP/SoC)

  • nano-interconnects and nano-structures

  • electromagnetic theory and modeling

  • transmission line theory and modeling

  • macromodeling and reduced order models

  • electromagnetic compatibility

  • design methodology/flow

  • measurements

  • jitter and noise modeling

  • stochastic/sensitivity analysis

  • electro-thermal modeling

  • chip-package co-design

  • novel CAD concepts

  • optical interconnects

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Important Date
  • May 07

    2017

    Conference Date

  • Mar 10 2017

    Draft Paper Acceptance Notification

  • May 07 2017

    Registration deadline