Introduction

Over the past seventeen years, this workshop has evolved into a forum of exchange on the latest research and developments on innovative schemes for signal and power integrity, and in the field of interconnect modeling, simulation and measurement at chip board and package levels. The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation. In view of last year's success, the Committee is looking forward to the 18th Edition which will convene at the Het Pand Convention Centre in Ghent, Belgium. On this web site you can find all information regarding the 18th IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in Ghent!

Call for paper

Important date

2014-02-14
Abstract submission deadline

Submission Topics

Emerging and advanced issues New design techniques and innovative architectures Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization with emphasis on: Innovative schemes for SI and PI Noise reduction techniques High-
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Important Date
  • Conference Date

    May 11

    2014

    to

    May 14

    2014

  • Feb 14 2014

    Abstract Submission Deadline

  • May 14 2014

    Registration deadline

Sponsored By
IEEE Components
Packaging and Manufacturing Technology Society
IEEE Electromagnetic Compatibility Society