2021 IEEE International Test Conference in Asia (ITC-Asia 2021)

Aug. 18 - 20, 2021

Shanghai · China

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Timetable

Timezone：Asia/Shanghai

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Day 2,Aug. 19, 2021Thursday

SS1	Start	End	Duration	ID	Title
SS1	B1. Fault Tolerant TSV and Latch Designs@Special Session 19 Aug 2021, 20:00-21:00 ZOOM Conference Enter meeting room Video CONFERENCE Oral Session Timetable V15 Updated：23 Aug 2021, 15:03
Session Chairs: Li Jiang, Zhengfeng Huang
20:00	20:20	20	29	A Low-Cost Quadruple-Node-Upset Self-Recoverable Latch Design Yan Wen Student/ChangSha university of science and technology Oral Presentation
20:20	20:40	20	50	Kelvin Bridge Structure Based TSV Test for Weak Faults Hao Chang/Anhui University of Finance & Economics Oral Presentation
20:40	21:00	20	47	A N:1 Single-Channel TDMA Fault-Tolerant Technique for TSVs in 3D-ICs Danqing Li/HeFei University of Technology Oral Presentation

SS2	Start	End	Duration	ID	Title
SS2	A3. Learning based Discovery in ATPG, DfT, and Reverse Engineering@Special Session 19 Aug 2021, 22:10-23:10 ZOOM Conference Enter meeting room Video CONFERENCE Oral Session Timetable V15 Updated：23 Aug 2021, 15:03
Session Chairs: Tanvir Arafin, Ying Zhang
22:10	22:30	20	45	Scalable Parallel Static Learning Xiaoze Lin student/Shantou University Oral Presentation
22:30	22:50	20	33	An optimized DFT technology based on machine learning Han Yang/Nanjing University of Posts and Telecommunications Oral Presentation
22:50	23:10	20	66	Identification of Counter Registers through Full Scan Chain Qidong Wang/Harbin Institute of Technology, Shenzhen Oral Presentation

Day 3,Aug. 20, 2021Friday

SS3	Start	End	Duration	ID	Title
SS3	A5. 3D test and 3D DFT@Special Session 20 Aug 2021, 20:00-21:00 ZOOM Conference Enter meeting room Video CONFERENCE Oral Session Timetable V15 Updated：23 Aug 2021, 15:03
Session Chairs: Vivek Chickermane, Senling Wang
20:00	20:20	20	35	3D Test Wrapper Design and Physical Optimization Vivek Chickermane/Cadence Design Systems；Subhasish Mukherjee /Cadence Oral Presentation
20:20	20:40	20	36	Testing and Fault-Localization Solutions for Monolithic 3D ICs Arjun Chaudhuri /Duke University Oral Presentation
20:40	21:00	20	37	Designing Parallel TAMs for 3D-SICs Based on IEEE Std 1838’s Flexible Parallel PortLeveraging Lessons-Learned on 2D-SOCs Erik Jan Marinissen Scientific Director/imec Oral Presentation

SS4	Start	End	Duration	ID	Title
SS4	A6. Test Methods Towards Zero Failure Rate for Safety-Critical ICs@Special Session 20 Aug 2021, 21:05-22:25 ZOOM Conference Enter meeting room Video CONFERENCE Oral Session Timetable V15 Updated：23 Aug 2021, 15:03
Session Chairs: Shi-Yu Huang, Dawen Xu
21:05	21:25	20	54	TAIWAN Online: Test AI with AN Codes Online for Automotive Chips Tsung-Chu Huang Professor/National Changhua University of Education Oral Presentation
21:25	21:45	20	69	Integrated Scratch Marker for Wafer Defect Diagnosis Katherine Shu-Min Li/National Sun Yat-Sen University Oral Presentation
21:45	22:05	20	65	Rigorous Test Flow for PLL to Identify Weak Devices Shi-Yu Huang/National Tsing Hua University Oral Presentation
22:05	22:25	20	72	AMSER-FF: Area-Minimized Soft-Error-Recoverable Flip-Flop for Radiation Hardening Charles H.-P. Wen Professor/National Yang Ming Chiao Tung University Oral Presentation

SS5	Start	End	Duration	ID	Title
SS5	B6 Top Papers of ITC’2020@Special Session 20 Aug 2021, 21:05-22:25 ZOOM Conference Enter meeting room Video CONFERENCE Oral Session Timetable V15 Updated：23 Aug 2021, 15:03
Session Chairs: Haihua Shen, Aibin Yan
21:05	21:25	20	49	Characterization, Modeling and Test of SyntheticAnti-FerromagnetFlip Defect in STT-MRAMs Wu Lizhou Post Doc./,Delft University of Technology Invited speech
21:25	22:05	40	43	Industrial Application of IJTAG Standards to the Test of Big-A/little-d Devices – plus Updates to the Latest State of IEEE P1687.2 Hans Martin von Staudt/DIALOG SEMICONDUCTOR Oral Presentation
22:05	22:25	20	44	Learning A Wafer Feature with One Training Sample Yueling Jenny Zeng/University of California Santa Barbara Oral Presentation

Important Date

Conference Date

Aug 18

2021

to

Aug 20

2021
May 10 2021

Draft paper submission deadline
Aug 16 2021

Early Bird Registration
Aug 19 2021

Contribution Submission Deadline
Aug 20 2021

Registration deadline

Sponsored By

IEEE
Tongji University
Chinese Computer Federation

Organized By

Tongji University

Contact Information

Prof. Zhang Ying
yi******@tongji.edu.cn

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Previous Conferences

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2022 IEEE International Test Conference in Asia
2019-09-03 Japan Tokyo
2019 IEEE International Test Conference in Asia
2018-08-15 China
2018 IEEE International Test Conference in Asia
2017-09-13 Taiwan, China Taipei
2017 IEEE International Test Conference in Asia
2014-11-10 China 杭州市
IEEE International Test Conference in Asia